Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture

Product Details
Customization: Available
Metal Coating: Copper
Mode of Production: SMT
Manufacturer/Factory & Trading Company

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Registered Capital
147802.18 USD
Plant Area
3200 square meters
  • Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
  • Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
  • Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
  • Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
  • Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
  • Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
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Basic Info.

Model NO.
HSPC-164
Base Material
FR-4
Certification
RoHS, CCC, ISO
Customized
Customized
Condition
Used
Product Name
OEM Reverse PCBA Engineering for Mobile Phone
Shipment Way
by Air by Sea
Payment Way
Tt
Min.Pin Space of IC
0.3mm
Min. Space of BGA
+/- 0.3mm
Max.Precision of IC Assembly
0.03mm
SMT Capacity
>2 Million Points/Day
DIP Capacity
>100K Parts/Day
Electronic
100kmonth
Test 
100% Aoi Testing
Transport Package
Pallets
Specification
600*600
Trademark
OEM ODM
Origin
China
HS Code
8517709000
Production Capacity
50000PCS/Year

Product Description

OEM reverse PCBA engineering for mobile phone circuit board assembly manufacture 
 
Company Profile
Shenzhen Hongzhou Smart Technology Co.,Ltd is a factory offering EMS (Electronic Manufacturing service) manufacturing.The main business of our factory is as below:
1. High Quality PCBA OEM & ODM service, including components sourcing and function testing
2.One-stop service including sheet metal and wire manufacturing
3. Mechanical and Electronic products assembly.


PCBA capability
Technology SMT, DIP
SMT capability 2,000,000 points per day
DIP capability 300,000 points per day
Experiences QFP, BGA, μBGA, CBGA
Process Lead-free
Programming Yes
Conformal coating Yes

PCB capability
Layer count 1-48 layers
Material fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,rogers,nelco
Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz
Board thickness 8-236mil(0.2-6.0mm)
Min.line width/space 3/3 mil(75/75um)
Min. drill size 8 mil(0.2mm)
Min. HDI laser drill size 3 mil(0.067mm)
Tolerance of hole size 2 mil(0.05mm)
PTH copper thickness 1 mil(25 um)
Solder mask color Green,blue,yellow,white,black,red
Peelable solder mask yes
surface treating HASL(ROHS), ENING,OSP,IMMERSION SILVER,IMMERSION TIN,flash gold,gold finger
Gold thickness 2-30u" (0.05-0.76um)
Blind hole/buried hole yes
V-cut yes
Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture
Why choose us?
With experience of working for global equipment group previously, our core team members are with great experience in EMS manufacturing and management. We devote ourselves into Industrial Control products, Medical products, New Energy products, Auto products, Financial industry products and other high-end products manufacturing. Supper manufacturing ability: 0201 parts can be placed easily for PCB Assembly; Over 10 years International experience, most of products are exports to United States, Canada, Germany, UK, Swiss and other developed countries in America and European.Grandtop, as a professional EMS manufacture, is certificated with ISO9001:2015, ISO13485:2016, and IAFT16949:2016. We always stick to the principle of " Quality is the future of a company" .

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