OEM Service PCBA Prototype PCB Assembly Manufacturing Printed Circuit Board

• Customization: Available
• Metal Coating: Copper
• Mode of Production: SMT
• Model NO.: PCB manufacturing
• Layers: Multilayer
• Base Material: FR-4
• Certification: RoHS, ISO
• Customized: Customized
• Condition: New
• Model No.: 0563
• PCBA-Testing: X-ray, Aoi
• Small Order: Acceptable
• Type: Rigid Circuit Board
• Flame Retardant: V0
• Processing Technology: Electrolytic Foil
• Insulation Materials: Organic Resin
• Material: Complex
• Transport Package: Antistatic Package+Plastic Box and Carton Box
• Trademark: Customized
• Origin: Shenzhen China
• HS Code: 8473409001
• Production Capacity: 100K/Month

Product Description

Who we are?
Shenzhen Hongzhou Technology Co., Ltd was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global customers.

We have more than 10 years of SMT manufacturing experience, well appointed  SMT ,DIP and assembly lines, offering one stop service from SMT,FPC,DIP,EMS, conformal coating, testing, final assembly, component procurement ,design, peripheral products support and so on. we are equipped with High-speed and accurately SMT Equipment ,and we provide a whole range of SPI,AOI,ICT,FCT,X-RAY,ROHS and aging testing for products. All ourshop floors are dust free, all lines are lead free, we are ISO9001 certified company.

We open BOM cost quotation,with high quality control strategy and 8D analysis method,we focus on top market customers, such as PCBAs on medical , industrial , financial,robotic,automobile , New Energy.
We service for many global customers,such as the globe leader in grain processing and a leading solution provider;the top 3 in medical industry customer in China; the global leader in Telehealth Sensors industry and so on.

What we can do?
1.    Electronic components sourcing
2.    PCB layout and design
3.    PCB manufacturing and PCB assembly
4.    Mechanical project design & manufacturing
5.    Enclosure assembly

Capabilities:
 

PCB capability and services:

1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price, 
good quality  and excellent service.

2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. 

3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. 

4. Quantities range from sample to mass order

5. 100% E-Test 

 

SMT(Surface Mounting technology),DIP.

1. Material Sourcing Service

2. SMT assembly and Through hole components insertion

3.100% AOI testing

4. IC pre-programming / Burning on-line

5.ICT testing

6.Function testing as requested 

7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)

8.Conformal coating

9.OEM/ODM also welcomed

 

Production Capacity
PCB Max. size	DIP capacity
Min component   size	01005
Min.pin space of IC	0.3mm
Min. space of BGA	0.3mm
Max.precision of IC assembly	±0.03mm
SMT capacity	≥2 million points/day
DIP capacity	≥100k parts/day

 

EMS  Capacity
electronic product final assembly	100k/month

Application
* industrial control,
* medical device,
* food equipment,
* laser module,
* communication device,
* PLC module,
* transducer module,
* traffic control,
* automobile,
* smart home system,


Why choose us?
With experience of working for global equipment group previously, our core team members are with great experience in EMS manufacturing and management. We devote ourselves into Industrial Control products, Medical products, New Energy products, Auto products, Financial industry products and other high-end products manufacturing. Supper manufacturing ability: 0201 parts can be placed easily for PCB Assembly; Over 10 years International experience, most of products are exports to United States, Canada, Germany, UK, Swiss and other developed countries in America and European.Grandtop, as a professional EMS manufacture, is certificated with ISO9001:2015, ISO13485:2016, and IAFT16949:2016. We always stick to the principle of " Quality is the future of a company" 




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